Beschreibung
The TR7600F3D presents a next generation inspection platform for the most demanding PCB design. The inline CT AXI solution combines ultra-high resolution imaging with high definition planar CT inspection, a new robust hardware platform and a redesigned intuitive software to achieve exceptional image quality and reliable inspection results.
Technische Daten
| Imaging System | |
|---|---|
| Camera |
7M flat panel detector |
| X-ray Source | Microfocus tube 130 kV max (user adjustable) |
| Imaging Resolution | 5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (3 settings factory configured) |
| Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT |
| Motion Table & Control | |
|---|---|
| X-Axis Control | High-precision ballscrew + AC-servo controller |
| Y-Axis Control | High-precision ballscrew + AC-servo controller |
| Z-Axis Control | High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 µm |
| Board Handling | |
|---|---|
| Max PCB Size | 900x460 mm |
| PCB Thickness | Max. 7 mm |
| Max PCB Weight | 12 kg |
| Top Clearance | @ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
| Bottom Clearance | @ 30 μm: 65 mm @ 5/10/15/20/25 μm: 70 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor Height | 880 - 920 mm * SMEMA Compatible |
| Inspection Functions | |
|---|---|
| Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
| Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
| Dimensions | |
|---|---|
| WxDxH | 1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm |
| Weight | 3850 kg |
| Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Anlagenmerkmale
- High Resolution 3D CT X-Ray Inspection
- True 3D Solder Joint Viewer
- Ultra High Resolution for 0250125mm Chips
