Beschreibung
The TR7600LL SIII series CT AXI is a new generation of TRI's hallmark inline PCBA inspection solutions. Designed for 100% inspection coverage of very large boards, the TR7600LL SIII delivers industry's fastest high resolution imaging performance and great image quality in the industry's most advanced automatic X-ray inspection.
Technische Daten
| Imaging System | |
|---|---|
| Camera | High-performance, ultra-sensitive line-scan cameras |
| X-ray Source | 130 kV max (user adjustable) |
| Imaging Resolution | 7 μm,10 μm,15 μm, 20 μm (3 settings factory configured) |
| Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT |
| Motion Table & Control | |
|---|---|
| X-Axis Control | High-precision ballscrew + AC-servo controller |
| Y-Axis Control | High-precision ballscrew + AC-servo controller |
| Z-Axis Control | High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 µm |
| Board Handling | |
|---|---|
| Max PCB Size | 1000 x 660 mm |
| PCB Thickness | 0.6 - 7 mm |
| Max PCB Weight | 12 kg [15 kg optional] |
| Top Clearance | @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm |
| Bottom Clearance | 70 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor Height | 880 - 920 mm (34.6 - 36.2 in.) * SMEMA Compatible |
| Inspection Functions | |
|---|---|
| Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
| Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
| Dimensions | |
|---|---|
| WxDxH | 1750 x 2140 x 1945 mm |
| Weight | 4500 kg |
| Power Requirement | 200 - 240 VAC three phase, 50/60 Hz, 7 kVA (346-416 VAC optional three phase transformer) |
Anlagenmerkmale
- Ultra-high Speed 3D CT X-Ray Inspection• Excellent Image Quality
- True 3D Solder Joint Viewer
- Extra Large Board Inspection
- High Resolution for 01005in Chips
